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材料特點(diǎn)：

1.無鉛中Tg材料  

2.材料Tg≥150。C(DSC),Td≥340°C  

3.與FR-4制造工藝兼容  

4.低Z-CTE及高耐熱信賴性,良好的抗CAF能力  

Material Characteristics

1.Middle Tg material lead-free

2.Material TG≥150。C (DSC), TD≥340 °C

3.Compatible with FR- 4 manufacturing process

4.Low Z-CTE and high heat-resistant reliability,excellent CAF resistance

產(chǎn)品應(yīng)用：

汽車板、個(gè)人電腦、筆記本、游戲設(shè)備、網(wǎng)路通信設(shè)備、厚銅產(chǎn)品等  

對(duì)等材料:1X-X58\XM825\X1000H 

Product Application

Automobile board, personal computer, notebook, gameequipment, network communication equipment, thickcopper products, etC

Equivalent material: IX-X58\)XM825\X1000H